CEI EN 60068-2-69
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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| Organization: | CEI |
| Publication Date: | 1 October 2017 |
| Status: | active |
| Page Count: | 62 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
scope:
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
Document History
February 1, 2020
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
October 1, 2018
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
CEI EN 60068-2-69
October 1, 2017
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
March 1, 2008
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Questa Norma fa parte della serie IEC/EN 60068 per le prove ambientali ed in particolare si occupa della saldabilità dei componenti SMD con il metodo della bilancia di bagnatura.
Essa descrive due...
November 1, 2007
Prove Ambientali - Parte 2-69: Prove - Prova Te: Prova di saldabilità di componenti elettronici per dispositivi a montaggio superficiale (SMD) con il metodo della bilancia di bagnatura
Questa Norma fa parte della serie IEC/EN 60068 per le prove ambientali ed in particolare si occupa della saldabilità dei componenti SMD con il metodo della bilancia di bagnatura.
Essa descrive due...
October 1, 1997
Prove ambientali - Parte 2: Prove - Prova Te: Prova di brasabilità di componenti elettronici per la tecnologia di montaggio superficiale attraverso il metodo del bilancio di bagnatura
La presente Norma descrive due metodi di prova a bilancio di bagnatura. Questi metodi determinano quantitativamente la brasabilità delle terminazioni su componenti montati in superficie. Inoltre...