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DLA - DSCC-VID-V62/18601

MICROCIRCUIT, LINEAR-DIGITAL, DUAL CORE MICROCONTROLLERS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 1 March 2018
Status: inactive
Page Count: 80
scope:

This drawing documents the general requirements of a high performance Dual-Core Microcontrollers microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-VID-V62/18601 REV A
August 24, 2023
MICROCIRCUIT, LINEAR-DIGITAL, DUAL-CORE MICROCONTROLLER, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance Dual-Core Microcontrollers microcircuit, with an operating temperature range of -55ºC to +125ºC.
DSCC-VID-V62/18601
March 1, 2018
MICROCIRCUIT, LINEAR-DIGITAL, DUAL CORE MICROCONTROLLERS, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance Dual-Core Microcontrollers microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEDEC JEP 155 - Recommended ESD Target Level for HBM Qualification
Published by JEDEC on July 1, 2018
The intent of this report is to document and provide critical information to assess and make decisions on safe ESD level requirements. The scope of this document is to provide this information to...
This document references:
JEP157A - Recommended ESD-CDM Target Levels
Published by JEDEC on April 1, 2022
The intent of this report is to document and provide critical information to assess and make decisions on safe CDM ESD level requirements. The scope of this document is to provide this information to...
This document references:
JEP95 JEDEC STD NO. 95-1 - JEDEC Standard No. 95-1 Section 4 Design Guidelines
Published by JEDEC on March 1, 1997
INTRODUCTION History JEDEC REGISTERED AND STANDARD OUTLINES FOR SEMICONDUCTOR DEVICES, JEDEC PUBLICATION 95, is the official JEDEC Publication that contains the registered or standard mechanical...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-9 - Test Boards for Area Array Surface Mount Package Thermal Measurements
Published by JEDEC on July 1, 2000
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of ball grid array (BGA) and land grid array (LGA) packages. It is intended to be used in...
This document references:
JS-001 - Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Device Level
Published by JEDEC on May 1, 2023
This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a...
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