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DOD - SMD 5962-80014

MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM

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Organization: DOD
Publication Date: 9 March 2018
Status: inactive
Page Count: 9
scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

November 12, 2019
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and...
SMD 5962-80014
March 9, 2018
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are...
May 20, 2011
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are...
February 23, 2004
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are...
July 1, 1998
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN)....
September 29, 1995
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534. The complete PIN shall be as shown in the following example: The device...
June 25, 1993
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534. The complete PIN shall be as shown in the following example: The device...
March 16, 1992
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
January 5, 1990
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
January 11, 1989
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
November 23, 1987
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
December 5, 1985
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
June 23, 1983
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
January 10, 1983
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.
December 22, 1980
MICROCIRCUIT, HYBRID, LINEAR, BUFFER AMPLIFIER, THICK FILM
A description is not available for this item.

References

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