scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 0033 Voltage follower/buffer amplifier with FET input

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Z See figure 1 12 Can package

The lead finish shall be as specified in MIL-H-38534. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . . ±40 V dc maximum Input voltage range . . . . . . . . . . . . . . . . . . ±40 V dc Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D) . . . . . . . . . . . . 1.5 W 1/ 2/ Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . +175°C

Ambient operating temperature range (T_A) . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.