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BSI - BS EN IEC 62969-3

Semiconductor devices - Semiconductor interface for automotive vehicles Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

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Organization: BSI
Publication Date: 30 June 2018
Status: active
Page Count: 30
ICS Code (Other semiconductor devices): 31.080.99

Document History

BS EN IEC 62969-3
June 30, 2018
Semiconductor devices - Semiconductor interface for automotive vehicles Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
A description is not available for this item.

References

This document references:
IEC 60749-10 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1
Published by IEC on August 1, 2003
A description is not available for this item.
This document references:
IEC 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Published by IEC on April 1, 2017
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid...
This document references:
IEC 62830-1 - Semiconductor devices – Semiconductor devices for energy harvesting and generation – Part 1: Vibration based piezoelectric energy harvesting
Published by IEC on March 1, 2017
This part of IEC 62830 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of vibration based...
This document references:
IEC 60749-12 - Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
Published by IEC on December 1, 2017
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
This document references:
IEC 62047-5 - Semiconductor devices – Micro-electromechanical devices – Part 5: RF MEMS switches
Published by IEC on July 1, 2011
This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The...
This document references:
IEC 62047-7 - Semiconductor devices – Micro-electromechanical devices – Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Published by IEC on June 1, 2011
This part of IEC 62047 describes terms, definition, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of BAW resonator, filter, and...
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