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BSI - BS EN 61191-6

Printed board assemblies Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

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Organization: BSI
Publication Date: 31 May 2010
Status: active
Page Count: 42
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61191-6
May 31, 2010
Printed board assemblies Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
A description is not available for this item.

References

This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Published by IPC on June 1, 2018
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
This document references:
EN 60068-1 - Environmental testing - Part 1: General and guidance
Published by CENELEC on March 1, 2014
A description is not available for this item.
This document references:
EN 60194 - Printed board design, manufacture and assembly - Terms and definitions
Published by CENELEC on July 1, 2006
A description is not available for this item.
This document references:
EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published by CENELEC on March 1, 2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
EN IEC 61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by CENELEC on November 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
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