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CENELEC - EN IEC 60749-20

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

active, Most Current
Organization: CENELEC
Publication Date: 1 October 2020
Status: active
Page Count: 32
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Document History

EN IEC 60749-20
October 1, 2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
November 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
June 1, 2003
Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

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