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CENELEC - EN IEC 60749-20

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

active, Most Current
Organization: CENELEC
Publication Date: 1 October 2020
Status: active
Page Count: 32
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Document History

EN IEC 60749-20
October 1, 2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
EN 60749-20
November 1, 2009
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.
EN 60749-20
June 1, 2003
Semiconductor devices - Mechanical and climatic test methods Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60749-3 - Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
Published by IEC on March 1, 2017
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...
This document references:
IEC 60749-30 - Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Published by IEC on August 1, 2020
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
This document references:
IEC 60749-35 - Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components
Published by IEC on July 1, 2006
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for...
This document is referenced by:
BS EN IEC 62435-7 - Electronic components — Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices
Published by BSI on January 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN IEC 63287-1 - Semiconductor devices - Generic semiconductor qualification guidelines Part 1: Guidelines for IC reliability qualification
Published by BSI on November 30, 2021
A description is not available for this item.
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