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IEC 61249-4-18

Materials for printed boards and other interconnecting structures – Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) – High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

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Organization: IEC
Publication Date: 1 November 2013
Status: active
Page Count: 34
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates.

Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

Document History

IEC 61249-4-18
November 1, 2013
Materials for printed boards and other interconnecting structures – Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) – High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing...

References

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