NPFC - MIL-PRF-38535

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR

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Organization:	NPFC
Publication Date:	1 December 1997
Status:	inactive
Page Count:	128

scope:

This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements which must be met for their acquisition. The intent of this specification is to allow the device manufacturer the flexibility to implement best commercial practices to the maximum extent possible while still providing product which meets the military performance needs. Detail requirements, specific characteristics of microcircuits, and other provisions which are sensitive to the particular use intended will be specified in the device specification. Quality assurance requirements outlined herein are for all microcircuits built on a manufacturing line which is controlled through a manufacturer's Quality Management (QM) program and has been certified and qualified in accordance with requirements herein. Several levels of product assurance including Radiation Hardness Assurance (RHA) are provided for in this specification. The certification and qualification sections found herein outline the requirements to be met by a manufacturer to be listed on a Qualified Manufacturer Listing (QML). After listing of a technology flow on a QML, the manufacturer must continually meet or improve the established baseline of certified and qualified procedures, the QM program, the manufacturer's review system, the status reporting and quality and reliability assurance requirements for all QML products. The manufacturer may present alternate methods of addressing the requirements contained in this document. This specification requires a manufacturer to establish a process flow baseline. If sufficient quality and reliability data is available, the manufacturer, through the QM program and the manufacturer's review system, may modify substitute or delete tests.* Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Supply Center Columbus, 3990 E. Broad Street, Columbus OH, 43216-5000 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

intended Use:

This specification is intended to support Government microcircuit application and logistic programs. Detailed characteristics of microcircuits needed for a program are to be defined by the device... View More

Screen MIL-STD-883 test method and condition --------------------------------------------------------------------------------------------------- 1. Electrostatic Discharge Sensitivity (ESD) 3015 (see 4.2.3, initial qualification only) 2. Wafer acceptance TRB plan (see H.3.2.3) 3. Internal visual 2010, test condition B (see J.3.3) 4. Temperature cycling 1010, test condition C, 50 cycles minimum 5. Constant acceleration 2001, test condition E (minimum) Y1 orientation only (see J.3.4) 6. Serialization In accordance with device specification 7. Interim (pre burn-in) electrical parameters In accordance with device specification 8. Burn-in test 1015, 160 hours at +125°C minimum (see J.3.5) 9. Interim (post burn-in) electrical parameters In accordance with device specification 10. Percent Defective Allowable (PDA) calculation 5 percent, all lots (subgroup I, table III, herein) 11. Final electrical test In accordance with device specification a. Static test (table III) 1. +25°C 2. Maximum and minimum rated operating temperature b. Dynamic or functional tests (table III) 1. +25°C 2. Maximum and minimum rated operating temperature c. Switching tests (tableIII) 1. +25°C 2. Maximum and minimum rated operating temperature 12. Seal 1014 (see J.3.7) a. Fine b. Gross 13. External visual 2009

TABLE IB. Tests/monitors for plastic packages. 1/

Test/monitor MIL-STD-883 test method or industry standard --------------------------------------------------------------------------------------------------------------------- 1. Wafer acceptance TRB plan (see H.3.2.3) 2. Internal visual TM 2010 or per manufacturers internal procedures 3. Temperature cycling/thermal shock TM 1010/TM 1011 4. Resistance to solvents TM 2015 5. Bond strength TM 2011 6. Ball shear ASTM F 1269 7. Solderability TM 2003 8. Die Shear or stud pull TM 2019 or TM 2027 9. Steady-state life test TM 1005 Endpoint electricals per device specification 10. Physical dimensions TM 2016 11. Lead integrity TM 2004 12. Inspection for delamination e.g., TM 1034 (dye penetrant), cross-sectioning, CSAM etc. 13. HAST 100 hours, +130°C, 85% RH 2/ 14. Autoclave JESD 22-A102 (no bias) 2 atm., +121°C 15. Salt atmosphere TM 1009 16. Adhesion to lead finish TM 2025 17. Interim pre bum-in electricals Per device specification 18. Burn-in test TM 1015, 160 hours at +125°C or per manufacturers OM plan 19. Interim post bum-in electricals Per device specification 20. Percent Defective Allowable (PDA) or alternate 1% PDA or per manufacturer's QM plan procedure for lot acceptance 21. Final electrical tests (see table III, herein, for Per device specification definition of subgroups) a. static b. dynamic c. functional d. switching 22. External visual TM 2009 or JESD 22-B101 or manufacturers internal procedures 1/ Test methods are listed herein to give the manufacturer an available method to use. Alternate procedures and test methods may be used. Monitor frequency and sample plan shall be in accordance with manufacturer's QM plan. 2/ An alternate process monitor may be used; e.g., +85°C/85% RH.

TABLE II. Group B tests.

MIL-STD-883 Minimum sample size Subgroup quantity (accept no.) Test Test Condition method --------------------------------------------------------------------------------------------------- 1 Resistance to solvents 2015 3(0) 2 Bond strength 2011 22(0) (1) Thermo compression (1) C or D Based on the number of (2) Ultrasonic (2) C or D wires (3) Flip-chip (3) F (4) Beam lead (4) H Die shear test 2019 or 3(0) or stud pull 2027 3 Solderability 2003 Solder temperature See J.3.9.2 +245°C ±5°C

*TABLE III. Group A electrical tests. 1/

Subgroup Parameters Quantity (accept no.) -------------------------------------------------------------------------------------- 1 Static tests at +25°C 116(0) 2 Static tests at maximum rated operating temperature 116(0) 3 Static tests at minimum rated operating temperature 116(0) 4 Dynamic tests at +25°C 116(0) 5 Dynamic tests at maximum rated operating temperature 116(0) 6 Dynamic tests at minimum rated operating temperature 116(0) 7 Functional tests at +25°C 116(0) 8 Functional tests at maximum and minimum rated operating 116(0) temperature 9 Switching tests at +25°C 116(0) 10 Switching tests at maximum rated operating temperature 116(0) 11 Switching tests at minimum rated operating temperature 116(0) 1/ The specific parameters to be included for test in each subgroup shall be as specified in the device specification. Where no parameters have been identified in a particular subgroup or test within a subgroup, no group A testing is required for that subgroup or test to satisfy group A requirements.

TABLE IV. Group C tests.

MIL-STD-883 Quantity Test (accept no.) Test method Condition ---------------------------------------------------------------------------------------------------- Subgroup 1 1005 Test condition to be specified 45(0) a. Steady-state (1,000 hrs at +125°C or life test equivalent) b. End-point electrical As specified in the applicable parameters device procurement specification

TABLE V. Group D tests.

MIL-STD-883 Subgroup Quantity accept no.) Test Test method Condition ------------------------------------------------------------------------------------------------------------------------- 1 Physical dimensions 2016 15(0) 2 a. Lead integrity 2004 B2 fatigue or as applicable 15(0) for the package technology style b. Seal (1) Fine 1014 As applicable (2) Gross 1014 As applicable 3 a. Thermal shock 1011 B, 15 cycles 15(0) b. Temperature cycling 1010 C, 100 cycles c. Moisture resistance 1004 d. Seal 1014 As applicable (1) Fine (2) Gross e. Visual 1004, 1010 f. End-point electricals As specified in the applicable device specification 4 a. Shock 2002 B 15(0) b. Vibration, variable frequency 2007 A c. Acceleration 2001 E, Y1 orientation or in accordance withJ.3.4 d. Seal 1014 As applicable (1) Fine (2) Gross e. Visual examination 2009 f. End-point electricals As specified in the applicable device specification 5 a. Salt atmosphere 1009 A 15(0) b. Seal 1014 As applicable (1) Fine (2) Gross c. Visual 1009 (Visual criteria) 6 Internal water vapor (cavity packages) 1018 5000 ppm +100°C 3(0) or 5(l) 7 Adhesion of lead finish 2025 15(0) 8 Lid torque 2024 glass frit seal only 5(0)

Microcircuits conforming to this appendix are intended for use for Government microcircuit application and logistic purposes. For maximum cost effectiveness while maintaining essential quality and reliability requirements, it is recommended that, for initial acquisitions for original equipment complements, the device class appropriate to the need of the application (see A.3.4) be acquired.

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