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DLA - SMD-5962-89734 REV A

MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 28 August 1991
Status: inactive
Page Count: 10
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT04 Hex inverter, TTL compatible inputs 02 54ACT11004 Hex inverter, TTL compatible inputs

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × ,200"), dual-in-line package D F-2 (14-lead, .390" × .260" × .085"), flat package R D-8 (20-lead 1,060" × .310" × ,200"), dual-in-line package 2 C-2 (20-terminal .358" × .358" × .100"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range 1/ - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range 1/ - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC input diode current - - - - - - - - - - - - - - - - - - - - - ±20 mA DC output diode current (per pin)- - - - - - - - - - - - - - - - ±50 mA DC output source or sink current - - - - - - - - - - - - - - - - ±50 mA DC VCC or GND current - - - - - - - - - - - - - - - - - - - - - ±150 mA Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) 2/ - - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Input voltage range (VIN)- - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage range (VOUT)- - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range (TC)- - - - - - - - - - - - - - −55°C to +125°C Input rise or fall times: VCC = 4.5 V to 5.5 V - - - - - - - - - - - - - - - - - - - - - 0 to 8 ns/V

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD 5962-89734
August 15, 2018
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-89734
January 26, 2017
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
SMD-5962-89734 REV F
May 16, 2013
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are...
SMD 5962-89734
March 19, 2007
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-89734 REV D
December 1, 2004
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-89734 REV C
June 24, 2002
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-89734 REV B
August 4, 1997
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-89734 REV A
August 28, 1991
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
SMD-5962-89734
August 14, 1989
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, HEX INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
A description is not available for this item.
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References

This document references:
JEDEC JESD 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices
Published by JEDEC on January 1, 1990
This standard describes electrical parameters for this class of CMOS devices.
This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
JEDEC JESD 78 - IC Latch-Up Test
Published by JEDEC on April 1, 2016
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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