scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT04 Hex inverter, TTL compatible inputs 02 54ACT11004 Hex inverter, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack R GDIP1-T20 or CDIP2-T20 20 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)........................................................................ −0.5 V dc to +6.0 V dc DC input voltage range (V_IN)...................................................................... −0.5 V dc to V_CC +0.5 V dc DC output voltage range (V_OUT).................................................................... −0.5 V dc to V_CC +0.5 V dc DC input diode current............................................................................ ±20 mA DC output diode current (per pin)................................................................. ±50 mA DC output source or sink current.................................................................. ±50 mA DC V_CC or GND current............................................................................. ±150 mA Maximum power dissipation (P_D)..................................................................... 500 mW Storage temperature range (T_STG)................................................................... −65°C to +150°C Lead temperature (soldering, 10 seconds).......................................................... +300°C Thermal resistance, junction-to-case (Θ_JC)......................................................... See MIL-STD-1835 Junction temperature (T_J).......................................................................... +175°C 4/

Supply voltage range (V_CC)........................................................................ 4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH) ........................................................... 2.0 V dc Maximum low level input voltage (V_IL) ............................................................ 0.8 V dc Input voltage range (V_IN) ........................................................................ +0.0 V dc to V_CC Output voltage range (V_OUT)....................................................................... +0.0 V dc to V_CC Maximum input rise or fall rate (Δt/ΔV):.......................................................... 0 to 8 ns/V Case operating temperature range (T_C)............................................................. −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)...................................................... XX percent 6/

intended Use: