scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 3702 Dual, low power, voltage comparator 02 3702 Dual, low power, voltage comparator

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual in line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_DD) .................... −0.3 V to 18 V 2/ Differential input voltage .................... ±18 V 3/ Input voltage range (V_IN) ..................... −0.3 V to V_DD Output voltage range (V_OUT) ................... −0.3 V to V_DD Input current (I_IN) ........................... ±5 mA Output current (IOUT), each output ............ ±20 mA Total current into V_DD terminal ............... 40 mA Total current out of ground terminal .......... 40 mA Storage temperature range ..................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ...... 300°C Junction temperature (T_J) ..................... +150°C Power dissipation (P_D): 4/ Case H ...................................... 675 mW Case P ...................................... 1050 mW Case 2 ...................................... 1375 mW Thermal resistance, junction-to-case (Θ_JC) .... See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA): Cases H and P ............................... 180°C/W Case 2 ...................................... 65°C/W

Supply voltage range: Device type 01 .............................. 4 V ≤ V_DD ≤ 16 V Device type 02 .............................. 2.5 V ≤ V_DD ≤ 5.5 V Common mode input voltage (V_IC) ............... 0 V ≤ V_IC ≤ V_DD − 1.5V High level output current ..................... −20 mA Low level output current ...................... 20 mA Ambient operating temperature range (T_A) ...... −55°C to +125°C

intended Use: