scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type(s) Generic number Circuit function 01 3702 Dual, low power, voltage comparator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line 2 CQCC1-N20 20 square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_DD) . . . . . . . . . . . . . . . . . . . . . −0.3 V to 18 V 2/ Differential input voltage . . . . . . . . . . . . . . . . . . . . . ±18 V 3/ Input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . . . −0.3 V to V_DD Output voltage range (V_OUT). . . . . . . . . . . . . . . . . . . . . −0.3 V to V_DD Input current (I_IN). . . . . . . . . . . . . . . . . . . . . . . . . ±5 mA Output current (I_OUT), each output . . . . . . . . . . . . . . . . . ±20 mA Total current into V_DD terminal . . . . . . . . . . . . . . . . . . 40 mA Total current out of ground terminal . . . . . . . . . . . . . . . . 40 mA Storage temperature range . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . 300°C Power dissipation (P_D): 4/ Case P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1050 mW Case 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1375 mW Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA): Case P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . 150°C

Supply voltage range . . . . . . . . . . . . . . . . . . . . . . . . 4 V ≤ V_DD ≤ 16 V Common-mode input voltage (V_IC) . . . . . . . . . . . . . . . . . . 0 V ≤ V_IC ≤ V_DD − 1.5 V High level output current . . . . . . . . . . . . . . . . . . . . . −20 mA Low level output current . . . . . . . . . . . . . . . . . . . . . . 20 mA Ambient operating temperature range . . . . . . . . . . . . . . . . −55°C to +125°C

intended Use: