scope:
This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
The complete PIN is as shown in the following example:
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 1823 High speed PWM controller
02 1823A High Speed PWM controller
03 1823B High speed PWM controller
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
E GDIP1-T16 or CDIP2-T16 16 Dual-in-line
2 CQCC1-N20 20 Square leadless chip carrier
The lead finish is as specified in MIL-PRF-38535, appendix A
Supply voltage (Vs):
Device type 01................................................................... 30 V dc
Device types 02 and 03........................................................... 2.2 V dc
DC output current, source or sink.................................................. 0.5 A
Pulse output current, sink or source (0.5 µs)
Device type 01................................................................... 2.0 A
Device types 02 and 03........................................................... 2.2 A
Analog input voltage:
Device type 01 (pins 1,2,7,8 and 9) 1/........................................... −0.3 V dc to 6.0 V dc.
Device types 02 and 03 (pins 1,2,and 7) 1/....................................... −0.3 V dc to 7.0 V dc
Device types 02 and 03 (pins 8 and 9) 1/......................................... −0.3 V dc to 6.0 V dc
Clock output current............................................................... −5.0 mA
Error amplifier output current..................................................... 5.0 mA
Soft start sink current............................................................ 20 mA
Oscillator charging current........................................................ −5.0 mA
Power dissipation (PD) 2/ 3/....................................................... 1.0 W
Storage temperature range.......................................................... −65°C to +150°C
Lead temperature (soldering, 10 seconds)............................................. +300°C
Junction temperature (TJ)............................................................ +150°C
Thermal resistance, junction-to-case (θJC)........................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case outline E..................................................................... 80°C/W
Case outline 2..................................................................... 70°C/W
Power ground:
Device types 02 and 03............................................................. ±0.2 V
Supply voltage (Vs)...................................................................... 10 V dc to 30 V dc
Ambient operating temperature range (TA)................................................ −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
