scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device letter Generic number Circuit function 01 1823 High speed PWM controller

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-Lead, .840" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package.

Supply voltage (V_S) - - - - - - - - - - - - - - - - - - - - - - 30 V dc DC output current, source or sink - - - - - - - - - - - - - - - 0.5 A Pulse output current, sink or source (0.5 µs) - - - - - - - - - 2.0 A Analog input voltage (pins 1,2,7,8 and 9) 1/ - - - - - - - - - −0.3 v dc to 6.0 v dc Clock output current - - - - - - - - - - - - - - - - - - - - - - −5.0 mA Error amplifies output current - - - - - - - - - - - - - - - - - 5.0 mA Soft start sink current - - - - - - - - - - - - - - - - - - - - 20 mA Oscillator charging current - - - - - - - - - - - - - - - - - - −5.0 mA Power dissipation (P_D) 2/ 3/ - - - - - - - - - - - - - - - - - - 1.0 W Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - +150°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA) Case outline E - - - - - - - - - - - - - - - - - - - - - - - 80°C/W Case outline 2 - - - - - - - - - - - - - - - - - - - - - - - 70°C/W

Supply voltage range - - - - - - - - - - - - - - - - - - - - - - 10 V dc to 30 V dc Ambient operating temperature (T_A) - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: