scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 64K × 8-bit UVEPROM 150 ns 02 64K × 8-bit UVEPROM 200 ns 03 64K × 8-bit UVEPROM 250 ns 04 64K × 8-bit UVEPROM 120 ns 05 64K × 8-bit UVEPROM 90 ns

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 2/ Y CQCC1-N32 32 Rectangular leadless chip carrier 2/ Z See figure 1 32 "J" lead chip carrier 2/

The lead finish is as specified in MIL-PRF-38535, appendix A.

Storage temperature range . . . . . . . . . . . . . . . . . −65°C to +150°C Input voltages with respect to ground . . . . . . . . . . . −0.6 V dc to +6.25 V dc Output voltages with respect to ground . . . . . . . . . . −0.6 V dc to V_CC +1.0 V dc Voltage on pin A9 with respect to ground . . . . . . . . . −0.6 V dc to +13.5 V dc V_PP supply voltage with respect to ground . . . . . . . . −0.6 V dc to +14.0 V dc Power dissipation (P_D) 3/ . . . . . . . . . . . . . . . . . 350 mW Lead temperature (soldering, 10 seconds) . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . +150°C

Case operating temperature range (T_C) . . . . . . . . . . . −55°C to +125°C Supply voltage range (V_CC) . . . . . . . . . . . . . . . . +4.5 V dc to 5.5 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.