DLA - SMD-5962-85087 REV E
MICROCIRCUIT, HYBRID, LINEAR, 0.2-AMP, POWER, OPERATIONAL AMPLIFIER, THICK FILM
| Organization: | DLA |
| Publication Date: | 3 May 1994 |
| Status: | inactive |
| Page Count: | 11 |
scope:
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 0041 High-power operational amplifier, externally compensated (0.2 ampere output)
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style Z See figure 1 12 Can
The lead finish shall be as specified in MIL-H-38534. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (±VS) . . . . . . . . . . . . . . ±18 V dc Input voltage . . . . . . . . . . . . . . . . . . ±l5 V dc 1/ Power dissipation (PD) . . . . . . . . . . . . . 1.5 W 2/ Differential input voltage . . . . . . . . . . . ±30 V dc Peak output current . . . . . . . . . . . . . . . 0.5 A 3/ Output short circuit duration . . . . . . . . . . Continuous 4/ Storage temperature range . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . +300°C Thermal resistance: Junction-to-case (θJC) . . . . . . . . . . . . 70°C/W Junction-to-ambient (θJA) . . . . . . . . . . . 100°C/W Junction temperature (TJ) . . . . . . . . . . . . +150°C
Ambient operating temperature range (TA) . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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