BSI - BS EN 62047-22
Semiconductor devices — Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
active, Most Current
Buy Now
| Organization: | BSI |
| Publication Date: | 31 October 2014 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
| ICS Code (Other graphical symbols): | 01.080.99 |
Document History
BS EN 62047-22
October 31, 2014
Semiconductor devices — Micro-electromechanical devices Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
A description is not available for this item.