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This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole,...
1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates, used in making flat panel information displays. It is assumed that the thickness of the conductive thin film is much thinner...
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface...
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface...
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount,...
This sectional specification prescribes the preferred values for characteristics and ratings and also the inspection requirements for fixed surface mount resistors of assessed quality. These resistors generally have metallised connecting pads and are intended to be mounted directly on...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature 156 coefficient thermistors, typically made from transition metal oxide materials with 157 semiconducting properties. These thermistors have metallized connecting pads or soldering 158 strips and are...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to...
This part of IEC 61192 specifies requirments for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of organic substrates. It applies to assemblies that are totally...
This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are...
This part of EN 60115 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be...
This part of IEC 62490 provides the ESL measuring method for the surface mount capacitors for use in electronic equipment. The ESL measurement method can be applicable to the surface mount capacitors with the following properties, but not limited to these: The ESL measurement method...
This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be...
This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally trough-hole or...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature 156 coefficient thermistors, typically made from transition metal oxide materials with 157 semiconducting properties. These thermistors have metallized connecting pads or soldering 158 strips and are...
This part of IEC 60539 is applicable to surface mount directly heated negative temperature 156 coefficient thermistors, typically made from transition metal oxide materials with 157 semiconducting properties. These thermistors have metallized connecting pads or soldering 158 strips and are...
IEC 62490-2:2010 provides the ESL measuring method for the surface mount capacitors for use in electronic equipment.
This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices...
