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IEC 61076-7-100 - Connectors for electronic equipment – Product requirements – Part 7-100: Cable outlet accessories – Detail specification for a metric cable sealing consisting of an integrated part of heavy-duty rectangular or circular connector hoods and a sealing system
May 1, 2006 - IEC

This part of IEC 61076-7 provides dimensional requirements, application information and tests for metric cable sealing of heavy-duty rectangular or circular connector hoods. Cable outlets in the sense of this detail specification comprise all the necessary parts designed to...

DS/EN 61076-7-100 - Connectors for electronic equipment - Product requirements - Part 7-100: Cable outlet accessories - Detail specification for a metric cable sealing consisting of an integrated part of heavy-duty rectangular or circular connector hoods and a sealing system
August 30, 2006 - DS

This part of IEC 61076-7 provides dimensional requirements, application information and tests for metric cable sealing of heavy-duty rectangular or circular connector hoods. Cable outlets in the sense of this detail specification comprise all the necessary parts designed to...

IEC 62899-402-3 - Printed electronics – Part 402-3: Printability – Measurement of qualities – Voids in printed pattern using a two-dimensional optical image
April 1, 2021 - IEC

This part of IEC 62899 specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable voids...

IEC 61587-6 - Mechanical structures for electrical and electronic equipment – Tests for IEC 60917 and IEC 60297 series – Part 6: Security aspects for indoor cabinets
April 1, 2021 - IEC

This part of IEC 61587 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism. NOTE Protection against vandalism is...

IEC 63229 - Semiconductor devices – Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
April 1, 2021 - IEC

This International Standard gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope...

IEC 60286-1 - Packaging of components for automatic handling – Part 1: Tape packaging of components with axial leads on continuous tapes
April 1, 2021 - IEC

This part of IEC 60286 applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling,...

IEC 60384-2 - Fixed capacitors for use in electronic equipment – Part 2: Sectional specification – Fixed metallized polyethylene-terephthalate film dielectric DC capacitors:
April 1, 2021 - IEC

This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have a possibility of "self-healing properties" depending on conditions of use. They are primarily...

IEC 60809 - Lamps and light sources for road vehicles – Dimensional, electrical and luminous requirements
April 1, 2021 - IEC

This document is applicable to electric light sources (see Note 1) for use in automotive applications, for example in road illumination devices and/or light signalling devices for road vehicles. It is especially applicable to light sources listed in UN Resolution R.E.5 and light sources subject to...

IEC 61189-5-301 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: General test methods for materials and assemblies – Soldering paste using fine solder particles
March 1, 2021 - IEC

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC...

IEC 60747-14-11 - Semiconductor devices – Part 14-11: Semiconductor sensors – Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
March 1, 2021 - IEC

This part of IEC 60747 defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement...

IEC 60825-2 - Safety of laser products – Part 2: Safety of optical fibre communication systems (OFCSs)
March 1, 2021 - IEC

This document provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCSs). In these systems, optical power is possibly accessible outside the confines of the transmitting equipment and/or at great distance from the optical source...

IEC 61967-4 REDLINE - Integrated circuits – Measurement of electromagnetic emissions – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
March 1, 2021 - IEC

This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree...

IEC TR 61191-8 - Printed board assemblies – Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices
March 1, 2021 - IEC

This part of IEC 61191gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components...

IEC 61967-4 - Integrated circuits – Measurement of electromagnetic emissions – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
March 1, 2021 - IEC

This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree...

IEC 63210 - Shunt power capacitors of the self-healing type for AC systems having a rated voltage above 1 000 V
March 1, 2021 - IEC

This document is applicable to both self-healing capacitor units and self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz. The following capacitors are...

IEC 63171 - Connectors for electrical and electronic equipment – Shielded or unshielded free and fixed connectors for balanced single-pair data transmission with current-carrying capacity – General requirements and tests
March 1, 2021 - IEC

This document covers shielded and unshielded free and fixed connectors, circular or rectangular, for balanced single-pair data transmission, with current-carrying capacity. It specifies the IEC 63171 series' common mechanical, electrical and transmission characteristics and environmental...

IEC TR 62977-5-2 - Electronic displays – Part 5-2: Visual assessment – Colour discrimination according to viewing direction
March 1, 2021 - IEC

This part of IEC 62977, which is a Technical Report, describes the visual assessment method of the viewing direction characteristics of display devices. This document reviews the visual assessment of viewing direction by using special test patterns to estimate colour changes, image...

IEC 62830-7 - Semiconductor devices – Semiconductor devices for energy harvesting and generation – Part 7: Linear sliding mode triboelectric energy harvesting
March 1, 2021 - IEC

This part of IEC 62830 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy...

IEC 62899-202-7 - Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
March 1, 2021 - IEC

This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to...

IEC 63245-1 - Spatial wireless power transfer based on multiple magnetic resonances – Part 1: Requirements
March 1, 2021 - IEC

This part of IEC 63245 specifies requirements for spatial wireless power transfer based on multiple magnetic resonances (SWPT-MMR), which is a non-radiative wireless power transfer (WPT). This document contains two categories of requirements: general requirements and functional requirements....

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