This part of IEC 62899 specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable...
This part of IEC 61587 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism. NOTE Protection against vandalism is...
This International Standard gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron...
This part of IEC 60286 applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling,...
This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terepht
This document is applicable to electric light sources (see Note 1) for use in automotive applications, for example in road illumination devices and/or light signalling devices for road vehicles. It is especially applicable to light sources listed in UN Resolution R.E.5 and light sources subject to...
This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC...
This part of IEC 60747 defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement...
This document provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCSs). In these systems, optical power is possibly accessible outside the confines of the transmitting equipment and/or at great distance from the...
This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree...
This part of IEC 61191gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components...
This part of IEC 61967 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree...
This document is applicable to both self-healing capacitor units and self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz. The following capacitors are...
This document covers shielded and unshielded free and fixed connectors, circular or rectangular, for balanced single-pair data transmission, with current-carrying capacity. It specifies the IEC 63171 series' common mechanical, electrical and transmission characteristics and environmental...
This part of IEC 62977, which is a Technical Report, describes the visual assessment method of the viewing direction characteristics of display devices. This document reviews the visual assessment of viewing direction by using special test patterns to estimate colour changes, image...
This part of IEC 62830 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy...
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to...
This part of IEC 63245 specifies requirements for spatial wireless power transfer based on multiple magnetic resonances (SWPT-MMR), which is a non-radiative wireless power transfer (WPT). This document contains two categories of requirements: general requirements and functional requirements....
This specification is intended as an extension to the existing[USB 2.0], [USB 3.2], [USB Type-C 2.0] and[USBBC 1.2] specifications. It addresses only the elements required to implement USB Power Delivery. It is targeted at power supply vendors, manufacturers of [USB 2.0], [USB 3.2], [USB Type-C 2...
This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed...