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This standard describes the methods for the analysis of all refractory products containing nitride and oxynitride bonded silicon carbide, irrespective of the silicon carbide level. It includes details of sample preparation, general principles of chemical analysis and detailed methods for the...
This standard describes methods for the determination of mineralogical phases typically apparent in nitride and oxy-nitride bonded silicon carbide refractory products using a Bragg-Brentano diffractometer. It includes details of sample preparation and general principles for qualitative and...
This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries. The micro-chevron-test is an experimental...
This part of ISO 21068 specifies methods for the determination of total nitrogen and nitrogen calculated as silicon nitride, total oxygen, and free metallic and oxidic components in silicon carbide raw materials and refractory products. It applies only to silicon carbide materials that are not...
This part of IEC 62951 specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic...
This part of IEC 62951 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices. The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin...
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 1.2 The values stated in inch-pound units are to be...
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 1.2 The values stated in inch-pound units are to be...
This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechani
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 1.2 The values stated in inch-pound units are to be...
1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. 1.2 The values stated in inch-pound units are to be...
IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly...
This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is...
This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechani
This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The values stated in inch-pound units are to be regarded as...
This test method is designed for determining the average electrical width of a narrow thin-film metallization line. This test method is intended for measuring thin metallization lines such as are used in microelectronic circuits where the width of the lines may range from micrometres to tenths of...
1.1 This test method is designed for determining the average electrical width of a narrow thin-film metallization line. 1.2 This test method is intended for measuring thin metallization lines such as are used in microelectronic circuits where the width of the lines may range from micrometres to...
This specification covers a coextruded cross linked polyethylene composite pressure pipe with welded aluminum tube reinforcement between the inner and outer layers. The inner and outer cross linked polyethylene layers are bonded to the aluminum tube by a melt adhesive. Included is a system...
