IEC 62047-22
Semiconductor devices – Micro-electromechanical devices – Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Organization: | IEC |
Publication Date: | 1 June 2014 |
Status: | active |
Page Count: | 24 |
ICS Code (Other semiconductor devices): | 31.080.99 |
scope:
This part of IEC 62047 specifies a tensile test method to
measure electromechanical properties of conductive thin
micro-electromechani
Document History
