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IEC PAS 62878-2-5 - Device embedded substrate – Guidelines – Data format
August 1, 2015 - IEC

This part of IEC 62878 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. The basic structures, the terminology, reliability...

DS/EN 62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
July 14, 2015 - DS

IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates...

IEC TR 62878-2-2 - Device embedded substrate – Part 2-2: Guidelines – Electrical testing
December 1, 2015 - IEC

This part of IEC 62878, which is a Technical Report, describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating...

IEC TS 62878-2-3 - Device embedded substrate – Part 2-3: Guidelines – Design guide
March 1, 2015 - IEC

This part of IEC 62878 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure...

CEI EN 62878-1-1 - Device embedded substrate Part 1-1: Generic specification - Test methods
February 1, 2016 - CEI

This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates...

IEC 62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
May 1, 2015 - IEC

This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates...

IEC/PAS 62326-14 - Printed boards – Part 14: Device embedded substrate – Terminology/reliability/design guide
September 1, 2010 - IEC

This PAS is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may...

IEC TS 62878-2-1 - Device embedded substrate – Part 2-1: Guidelines – General description of technology
March 1, 2015 - IEC

This part of IEC 62878 describes the basics of device embedding substrate. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication...

CEI EN IEC 62878-1 - Device embedding assembly technology Part 1: Generic specification for device embedded substrates
May 1, 2020 - CEI

This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded...

DS/EN IEC 62878-1 - Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
December 10, 2019 - DS

This part of IEC 62878 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded...

IEC 62878-1 - Device embedding assembly technology – Part 1: Generic specification for device embedded substrates
October 1, 2019 - IEC

This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded...

IEC TR 62878-2-7 - Device embedding assembly technology Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit boards
March 1, 2019 - IEC

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

DS/ISO/IEC 19761 - Software engineering - COSMIC: a functional size measurement method
April 6, 2011 - DS

This International Standard specifies the set of definitions, conventions and activities of the COSMIC Functional Size Measurement Method. It is applicable to software from the following functional domains: a) application software; EXAMPLE Banking, insurance, accounting, personnel,...

IEC TS 62878-2-4 - Device embedded substrate – Part 2-4: Guidelines – Test element groups (TEG)
March 1, 2015 - IEC

This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or...

DS/ISO/IEC 16326 - Systems and software engineering – Life cycle processes – Project management
December 22, 2009 - DS

This International Standard is intended to aid project managers in managing to successful conclusion those projects concerned with software-intensive systems and software products. This International Standard specifies the required content of the project management plan (PMP)....

BS PD IEC/PAS 62878-2-5 - Device embedded substrate — Guidelines — Data format
August 31, 2015 - BSI
A description is not available for this item.
DS/ISO/IEC 26511 - Systems and software engineering – Requirements for managers of user documentation
January 18, 2012 - DS

This International Standard supports the needs of software users for consistent, complete, accurate, and usable documentation. It provides requirements for strategy, planning, performance, and control for documentation managers. It specifies procedures for managing user documentation...

CEI EN IEC 62878-2-5 - Device embedding assembly technology Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
April 1, 2020 - CEI

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive...

DS/EN IEC 62878-2-5 - Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate
November 28, 2019 - DS

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate , that is, active and passive devices embedded board whose electrical connections are made by means of a via, electroplating, conductive paste or...

IEC 62878-2-5 - Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate
September 1, 2019 - IEC

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive...

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