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Requirements for style, layout and minimum content of detail specifications.
PREFACE This standard has been prepared by IEC Technical Committee No. 40: Capacitors and Resistors for Electronic Equipment. Further information can be found in the relevant Report on Voting indicated in the table above. The QC number that appears on the front cover of this publication is the...
This Standard covers the design, qualification, installation, commissioning, operation, maintenance, testing, inspection, and documentation requirements for systems providing heat removal from the reactor core to the ultimate heat sink(s) for water-cooled nuclear power plants...
Devices of large size with high power consumption are fairly common. A heat sink may be used to dissipate heat from devices with high power consumption or those outputting a large amount of thermal energy. Such devices may endure high mechanical compressive stress from the...
This CID specification sheet covers 3 piece card holders that use a lever, with a locking feature, to actuate wedges to hold circuit card assemblies into their installed positions in heat sinking devices (cold plates, heat exchanger) or other applications. Card holders covered...
This commercial item description (CID) covers the general requirements for a family of 3 piece card holders that use screw actuated wedge retainers to hold circuit card assemblies into their installed positions in heat sinking devices (cold plates, heat exchanger, etc.) or...
This commercial item description (CID) covers the general requirements for a family of 7 piece wedge card holders for holding circuit card assemblies (CCA) into their installed positions when used in heat sinking devices (cold plates, heat exchanger) or other applications. Card...
This commercial item description (CID) covers the general requirements for a family of 5 piece wedge card holders for holding circuit card assemblies into their installed positions when used in heat sinking devices (cold plates, heat exchanger) or other applications. Card...
This standard covers cool-storage systems composed of chillers, storage medium, storage device or vessel, heat sink equipment or heat sink systems, and other auxiliary equipment required to provide a complete and working system. This standard includes a. a uniform method...
Material Description. This specification covers the properties of a thermally conductive, heat stabilized polyamide 6 for injection molding. Symbols. The material abbreviations according to ISO 11469 are shown in Table 1. Applicability. Typical applications include, but are not limited, to...
Scope. This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic or thermosetting base materials, that will use...
This drawing outlines the requirements for a specific member of a family of compact high contact density (.050 inch (1.27 mm)), high performance two piece electrical connectors. These connectors are intended for printed circuit board (plug in dual heat sinked daughter board modules,...
This drawing outlines the requirements for a specific member of a family of compact high contact density (.050 inch (1.27 mm)), high performance two-piece electrical connectors. These connectors are intended for printed circuit board (plug in dual heat sinked daughter board modules,...
Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic, thermosetting, or thermoplastic and thermosetting base...
3.1 Fig. 1 is a sectional view of an example circular foil heat-flux transducer. It consists of a circular Constantan foil attached by a metallic bonding process to a heat sink of oxygen-free high conductivity copper (OFHC), with copper leads attached at the center of the...
3.1 Fig. 1 is a sectional view of an example circular foil heat-flux transducer. It consists of a circular Constantan foil attached by a metallic bonding process to a heat sink of oxygen-free high conductivity copper (OFHC), with copper leads attached at the center of the...
