UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 61189-3

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

active, Most Current
Buy Now
Organization: BSI
Publication Date: 31 March 2008
Status: active
Page Count: 62
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61189-3
March 31, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
BS EN 61189-3
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
BS EN 61189-3
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
BS EN 61189-3
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.

References

This document references:
IEC 60584-1 - Thermocouples – Part 1: EMF specifications and tolerances
Published by IEC on August 1, 2013
This part of IEC 60584 specifies reference functions and tolerances for letter-designated thermocouples (Types R, S, B, J, T, E, K, N, C and A). Temperatures are expressed in degrees Celsius based on...
This document references:
IEC 61189-1 - Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Published by IEC on November 1, 2001
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 62326-4 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
Published by IEC on December 1, 1996
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made....
This document references:
BS EN ISO 9002 - Quality Systems Model for Quality Assurance in Production, Installation and Servicing
Published by BSI on July 15, 1994
Quality system requirements for use where a supplier's capability to supply conforming product to an established design needs to be demonstrated.
This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document is referenced by:
BS EN 61249-8-8 - Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings
Published by BSI on December 15, 1997
A description is not available for this item.
This document is referenced by:
BS EN 62326-1 - Printed Boards Part 1: Generic Specification
Published by BSI on August 16, 2002
A description is not available for this item.
This document is referenced by:
BS EN 61188-1-2 - Printed Boards and Printed Board Assemblies - Design and Use - Part 1-2: Generic Requirements - Controlled Impedance
Published by BSI on December 15, 1998
A description is not available for this item.
This document is referenced by:
BS EN 61249-4-1 - Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Published by BSI on July 31, 2008
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement