JEDEC JESD 22-B112
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
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| Organization: | JEDEC |
| Publication Date: | 1 August 2018 |
| Status: | active |
| Page Count: | 30 |
scope:
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.
Document History
November 1, 2023
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount...
JEDEC JESD 22-B112
August 1, 2018
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount...
October 1, 2009
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount...
May 1, 2005
High Temperature Package Warpage Measurement Methodology
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