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IEC 62483

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

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Organization: IEC
Publication Date: 1 September 2013
Status: active
Page Count: 100
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation.

This International Standard does not apply to semiconductor devices with bottom-only terminations where the full plated surface is wetted during assembly (for example: quad-flat no-leads and ball grid array components, flip chip bump terminations). Adherence to this standard includes meeting the reporting requirements described in Clause 6.

Document History

IEC 62483
September 1, 2013
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices....
September 1, 2006
Test method for measuring whisker growth on tin and tin alloy surface finishes
The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not...

References

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