IPC - TM-650 2.6.8E
Thermal Stress, Plated-Through Holes
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 May 2004 |
| Status: | active |
| Page Count: | 2 |
scope:
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process.
Document History
TM-650 2.6.8E
May 1, 2004
Thermal Stress, Plated-Through Holes
This test is performed for the purpose of determining whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly,...
March 1, 1998
Thermal Stress, Plated-Through Holes
A description is not available for this item.
August 1, 1997
Thermal Stress, Plated-Through Holes
A description is not available for this item.
December 1, 1983
Thermal Stress, Plated-Through Holes
A description is not available for this item.