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IEC 61189-2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures

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Organization: IEC
Publication Date: 1 May 2006
Status: active
Page Count: 128
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

 

Document History

IEC 61189-2
May 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.

References

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