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BSI - BS EN 61249-2-13

Materials for Printed Boards and Other Interconnecting Structures - Part 2-13: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Cyanate Ester Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad

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Organization: BSI
Publication Date: 15 June 1999
Status: active
Page Count: 20
ICS Code (Immunity): 33.100.20
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61249-2-13
June 15, 1999
Materials for Printed Boards and Other Interconnecting Structures - Part 2-13: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Cyanate Ester Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad
A description is not available for this item.

References

This document references:
IEC 61189-1 - Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Published by IEC on November 1, 2001
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 61189-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
Published by IEC on May 1, 2006
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
This document references:
BS EN 61189-2 - Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
Published by BSI on November 30, 2006
A description is not available for this item.
This document references:
EN 61249-5-1 - Materials for Interconnection Structures Part 5. Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 1. Copper Foils (for the Manufacture of Copper- Clad Base Materials)
Published by CENELEC on January 1, 1996
A description is not available for this item.
This document references:
IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Published by IEC on October 1, 2007
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 61249-5-1 - Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Published by IEC on November 1, 1995
A description is not available for this item.
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