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CEI EN IEC 61190-1-3

Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

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Organization: CEI
Publication Date: 1 June 2018
Status: active
Page Count: 52
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.

Document History

CEI EN IEC 61190-1-3
June 1, 2018
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
CEI EN 61190-1-3
July 1, 2011
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
La presente Variante modifica la Norma CEI EN 61190-1-3:2008-04 relativa ai materiali di fissaggio per l'assemblaggio elettronico (Leghe e saldanti flussati per la saldatura elettronica). Le...
CEI EN 61190-1-3
April 1, 2008
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
La presente parte della IEC/EN 61190 definisce i requisiti ed i metodi di prova per le leghe saldanti a barra, a nastro e in polvere, flussate e non flussate, diverse dalla pasta saldante, per...
EN 61190-1-3
November 1, 2007
Materiali di fissaggio per assemblaggio elettronico - Parte 1-3: Prescrizioni per leghe saldanti per l'elettronica e per saldanti solidi flussati e non flussati, impiegati per applicazioni di saldatura in elettronica
La presente parte della IEC/EN 61190 definisce i requisiti ed i metodi di prova per le leghe saldanti a barra, a nastro e in polvere, flussate e non flussate, diverse dalla pasta saldante, per...
EN 61190-1-3
January 1, 2003
Materiali di fissaggio per assiemi elettronici - Parte 1-3: Prescrizioni per leghe saldanti di categoria elettronica e saldanti solidi flussati e non flussati nell'assemblaggio dei componenti elettronici
La presente parte della IEC 61190 definisce i requisiti ed i metodi di prova per le leghe saldanti a barra, a nastro e in polvere, flussate e non flussate, diverse dalla pasta saldante, per...

References

This document references:
ISO 1073-1 - Alphanumeric Character Sets for Optical Recognition - Part 1: Character Set OCR-A - Shapes and Dimensions of the Printed Image
Published by ISO on December 1, 1976
This International Standard for character shapes and sizes is intended to facilitate and foster the use of Optical Character Recognition (OCR) in data processing, by defining character shapes...
This document references:
IEC 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
IEC 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
CEI EN 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal materials without surface processing
Published by CEI on April 1, 2014
This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as...
This document is referenced by:
CEI EN 60749-21 - Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability
Published by CEI on May 1, 2012
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
This document is referenced by:
CEI EN 61189-11 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Published by CEI on February 1, 2014
This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for...
This document is referenced by:
CEI EN 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by CEI on May 1, 2016
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
CEI EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CEI on August 1, 2005
La presente Norma fa parte della serie 60068 e descrive la prova Td applicabile ai dispositivi a montaggio superficiale su substrati. Vengono trattate leghe di saldatura con e senza piombo (Lead...
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