scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-PRF-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number(PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 WF512K32-150, ACT-F512K32N-150 EPROM FLASH, 512K × 32-bit 150nS 02 WF512K32-120, ACT-F512K32N-120 EPROM FLASH, 512K × 32-bit l20nS 03 WF512K32-90, ACT-F512K32N-090 EPROM FLASH, 512K × 32-bit 90nS 04 WF512K32-70, ACT-F512K32N-070 EPROM FLASH, 512K × 32-bit 70nS

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M See figure 1 68 Co-fired ceramic, single/dual cavity, quad flatpack T See figure 1 68 Co-fired ceramic, single cavity, low profile, quad flatpack U See figure 1 66 Co-fired ceramic, Hex-in-line, single cavity, with standoffs N See figure 1 68 Co-fired ceramic, single cavity, quad flatpack, low capacitance X See figure 1 66 Co-fired ceramic, Hex-in-line, single cavity, without standoffs

The lead finish shall be as specified in MIL-PRF-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or Its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) .......................... −2.0 V dc to +7.0 V dc Signal voltage range (V_G)(any pin except A9 2/) ..... −2.0 V dc to +7.0 V dc Power dissipation (P_D) .............................. 1.32 W Max.at 5 MHz Storage temperature range ........................... −65° C to +150° C Lead temperature (soldering, 10 seconds) ............ +300° C Data retention ...................................... 10 years minimum Endurance (write/erase cycles) ...................... 10,000 cycles minimum A9 voltage for sector protect (V_ID)3/ ............... −2.0 V dc to +14.0 V dc

Supply voltage range (V_CC) .......................... +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ....................... −0.5 V dc to +0.8 V dc Input high voltage range (V_IH)....................... +2.0 V dc to V_CC +0.5 V dc Case operating temperature (T_C) ..................... −55° C to +125° C A9 voltage for sector protect ....................... +11.5 V dc to +12.5 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.