scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device types identify the circuit function as follows:

Device type Generic number 1/ Circuit function Date retention Access time 01 512K × 8 CMOS SRAM No 45 ns 02 512K × 8 CMOS SRAM No 35 ns 03 512K × 8 CMOS SRAM No 25 ns 04 512K × 8 CMOS SRAM No 20 ns 05 512K × 8 CMOS SRAM Yes 45 ns 06 512K × 8 CMOS SRAM Yes 35 ns 07 512K × 8 CMOS SRAM Yes 25 ns 08 512K × 8 CMOS SRAM Yes 20 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outlines are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T32 or CDIP2-T32 32 dual-in-line Y See figure 1 32 TSOP package Z See figure 1 32 leadless chip carrier U See figure 1 32 SOJ package T See figure 1 36 flat pack

Outline letter Descriptive designator Terminals Package style M See figure 1 36 SOJ package N See figure 1 36 leadless chip carrier 9 See figure 1 32 flat pack 8 See figure 1 36 SOJ package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Voltage on any input relative to V_SS ............... −0.5 V dc to +7.0 V dc Storage temperature range .......................... −65°C to + 150°C Maximum power dissipation (P_D) ..................... 2.0 W Lead temperature (soldering, 10 seconds) ........... +260°C Thermal resistance, junction-to-case(Θ_JC): Case X ............................................ See MIL-STD-1835 Case Y ............................................ 6°C/W Case U, M, and 8 .................................. 11°C/W Case T ............................................ 10°C/W Cases Z and N ..................................... 20°C/W Cases 9 ........................................... 22°C/W Junction temperature (T_J) .......................... +150°C 2/ Output current ..................................... 40 mA

Supply voltage range (V_CC) ......................... 4.5 V dc to 5.5 V dc Supply voltage (V_SS) ............................... 0 V Input high voltage range (V_IH) ..................... 2.2 V dc to +6.0 V dc Input low voltage range (V_IL) ...................... −0.5 V dc to +0.8 V dc 3/ Case operating temperature range (T_C)............... −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) .............. 4/ percent

intended Use: