scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-PRF-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-PRF-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Data retention Access time 01 512K × 8 CMOS SRAM No 45 ns 02 512K × 8 CMOS SRAM No 35 ns 03 512K × 8 CMOS SRAM No 25 ns 04 512K × 8 CMOS SRAM No 20 ns 05 512K × 8 CMOS SRAM Yes 45 ns 06 512K × 8 CMOS SRAM Yes 35 ns 07 512K × 8 CMOS SRAM Yes 25 ns 08 512K × 8 CMOS SRAM Yes 20 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T32 or CDIP2-T32 32 dual-in-line Y See figure 1 32 TSOP package Z See figure 1 32 leadless chip carrier U See figure 1 32 SOJ package T See figure 1 36 flat pack M See figure 1 36 SOJ package N See figure 1 36 leadless chip carrier 9 See figure 1 32 flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-PRF-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage on any input relative to V_SS - - - - - - - - - −0.5 V dc to +7.0 V dc Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - 2.0 W Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case Y - - - - - - - - - - - - - - - - - - - - - - - 6°C/W Cases U and M - - - - - - - - - - - - - - - - - - - - 11°C/W Case T - - - - - - - - - - - - - - - - - - - - - - - 10°C/W Cases Z and N - - - - - - - - - - - - - - - - - - - - 20°C/W Case 9 - - - - - - - - - - - - - - - - - - - - - - - 22°C/W Junction temperature (T_J) - - - - - - - - - - - - - - - +150°C 2/ Output current - - - - - - - - - - - - - - - - - - - - 40 mA

Supply voltage range (V_CC) - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Supply voltage (V_SS) - - - - - - - - - - - - - - - - - 0 V Input high voltage range (V_IH) - - - - - - - - - - - - 2.2 V dc to +6.0 V dc Input low voltage range (V_IL) - - - - - - - - - - - - - −0.5 V dc to +0.8 V dc 3/ Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 4/ percent

intended Use: