scope:

This drawing documents two product assurance classes, high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 WE-128K32-300HQ, ACT-E128K32N-300P7Q EEPROM, 128K × 32-bit 300 ns 02 WE-128K32-250HQ, ACT-E128K32N-250P7Q EEPROM, 128K × 32-bit 250 ns 03 WE-128K32-200HQ, ACT-E128K32N-200P7Q EEPROM, 128K × 32-bit 200 ns 04 WE-128K32-150HQ, ACT-E128K32N-150P7Q EEPROM, 128K × 32-bit 150 ns 05 WE-128K32-140HQ EEPROM, 128K × 32-bit 140 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device performance documentation H or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M See figure 1 68 Ceramic, dual cavity, quad flatpak N See figure 1 68 Ceramic, quad flatpak T See figure 1 66 Hex-in-line, single cavity, with standoffs U See figure 1 66 Hex-in-line, single cavity, without standoffs X See figure 1 66 Hex-in-line, single cavity, with standoffs Y See figure 1 66 Hex-in-line, single cavity, without standoffs 4 See figure I 66 1.075", hex-in-line, single cavity, with standoffs 5 See figure 1 66 1.075", hex-in-line, single cavity, with standoffs

The lead finish shall be as specified in MIL-PRF-38534 for classes H and K.

Supply voltage range (V_CC) ............................. −0.6 V to +6.25 V Input voltage range .................................... −0.6 V to +6.25 V Power dissipation (P_D) ................................. 1.4 W Storage temperature range .............................. −65°C to +150°C Lead temperature (soldering, 10 seconds)................ +300°C Thermal resistance junction-to-case (θ_JC): Case outlines T, U, Y, 4, and 5 ...................... 2.0°C/W Case outline M ....................................... 9.4°C/M Case outline N ....................................... 4.3°C/M Data retention ......................................... 10 years minimum Endurance ............................................ 10,000 cycles minimum

Supply voltage range (V_CC) ............................. +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) .......................... −0.5 V dc to +0.8 V dc Input high voltage range (V_IH) ......................... +2.0 V dc to V_CC + 0.3 V dc Output voltage, High minimum (V_OH) ..................... +2.4 V dc Output voltage, low maximum (V_OL) ...................... +0.45 V dc Case operating temperature range (T_C) .................. −55°C to + 125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.