NPFC - MIL-STD-883

TEST METHOD STANDARD MICROCIRCUITS

inactive

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Organization:	NPFC
Publication Date:	19 August 1994
Status:	inactive
Page Count:	649

scope:

This standard establishes uniform methods, controls, and procedures for designing, testing, identifying and certifying microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; physical and electrical tests; design, package and material constraints; general marking requirements; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes:

a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproduce of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions.

b. To describe in one standard all of the test methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices.

c. The test methods described herein for environmental, physical, and electrical testing of devices shall also apply, when applicable, to parts not covered by an approved Military/NASA specification, Military/NASA sheet-form standard, specification sheet, or drawing.

d. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard.

intended Use:

When this document is referenced or used in conjunction with the processing and testing of JAN devices in conformance with the requirements of appendix A of MIL-I-38535, QML devices in... View More

When this document is referenced or used in conjunction with the processing and testing of JAN devices in conformance with the requirements of appendix A of MIL-I-38535, QML devices in conformance with MIL-I-38535 or non-JAN devices in accordance with 1.2.1 or 1.2.2 herein, such processing and testing shall be in full conformance with all the applicable general requirements and those of the specifically referenced test methods and procedures.

For contracts negotiated prior to 31 December 1984, device types that have been classified as manufacturer's 883 (B or S) product prior to 31 December 1984 shall not have to meet 1.2.1 or 1.2.2.

Existing contracts as of the 31 December 1984, previously negotiated add-ons to these contracts, and future spares for these contracts may continue to use device types which were classified as manufacturer's 883 (B or S) prior to 31 December 1984.

*New contracts, and any device types classified as compliant to MIL-STD-883 after 31 December 1984 shall comply with 1.2.1. Any devices meeting only the provisions of 1.2.2 are noncompliant to MIL-STD-883. The requirements of 1.2.1 are met or exceeded by product built to a QML certified flow by a QML certified and qualified manufacturer or by a manufacturer who has been granted transitional certification to MIL-I-38535. The QML flow as documented in the QM plan allows modification to processes and tests used in producing QML devices. These changes shall not effect the form, fit, or function of any devices defined by device class M SMDs, the manufacturer's 883 compliant class B databook product, or contractor prepared drawings released before 31 December 1993, which call out these devices. These devices are marked with the "Q" or "QML" certification mark to reflect the QML flow used. The acquiring activity shall be notified of the marking change prior to shipping of these devices.

Supersedes page 1 of Notice 1 of MIL-STD-883D.

When any manufacturer, contractor, sub-contractor, or original equipment manufacturer requires or claims a non-JAN part compliant with MIL-STD-883, all provisions of this paragraph shall be met. In addition, manufacturers that have produced or are producing products in accordance with 1.2.1a and b are subject to a Government compliance validation audit on a drop-in basis with a minimum of notice. Such processing and testing shall be in compliance with all of the applicable general controls and requirements defined herein and those of the specifically referenced test methods and procedures with no reinterpretations, deviations or omissions except as specifically allowed in the military detail specification covering the same generic device. Deviations specifically granted in the military detail specification may also be applied to devices manufactured in the same process, to the same design criteria, and using elements of the same microcircuit group as those used for devices covered by the military detail specification. Such reference includes the following:

Manufacturers who use MIL-STD-883 in device marking, or make statements in applicable certificates of conformance that parts are compliant with MIL-STD-883, or make statements in advertisements or in published brochures or other marketing documents that parts provided are compliant with MIL-STD-883.

Contractors, sub-contractors, or original equipment manufacturers who prepare Source Control drawings, Specification Control drawings, or Selected Item drawings which require compliance with MIL-STD-883, or invoke it in its entirety as the applicable standard (see 1.2.2 for noncompliant devices).

Compliant devices shall meet the following requirements as a minimum:

a. The electrical test requirements (parameters, test conditions, test limits, and applicable test temperatures) which apply to electrical screening (i.e., final electrical parameters), group A Quality Conformance Inspection (QCI), and end point electrical testing for other QCI subgroups shall be clearly documented by the manufacturer as to the actual parameters, conditions, methods, limits, burn-in/life test circuits, and test temperatures used in device testing. All those parameters important to the design application of the device shall be specified over the full military operating temperature range and supply voltage range and be included in the testing requirements of the applicable specification(s). For devices whose initial release date is after (29 May 1987), the subgroups to be tested, and the parameters that constitute a subgroup shall as a minimum be equivalent to those of the most similar military detail specification. The manufacturer's electrical test specification must be documented in a military detail specification table I format, or equivalent, that is clear to the user and must be available to the user on request.

b. Custom monolithic, non-JAN multichip and all other non-JAN microcircuits except non-JAN hybrids (see 1.2.1c below) described or implied to be compliant with methods 5004 and 5005 or 5010 of MIL-STD-883 shall meet all of the following requirements as defined in appendix A of MIL-I-38535.

(1) All terms and definitions in accordance with 30.1.3, except that the qualifying activity shall be either the acquiring activity or quality organization within the manufacturer's company that is independent of the group(s) responsible for device production screening and marketing or by an independent organization outside the manufacturers company.

(2) Package requirements in accordance with 30.5.1.

(3) Metal requirements in accordance with 30.5.2.

(4) Other material requirements in accordance with 30.5.3.

(5) Control and traceability of design documentation for all new designs and redesigns shall follow the guidelines of 30.5.4 and include as a minimum; design, topology, interconnects, and schematics (except for submission of documentation to qualifying activity).

*(6) Internal conductor provisions in accordance with 30.5.5. Verification of glassivation layer integrity in accordance with 30.5.5.4 is required.

*(7) Lead material and finish requirements in accordance with 30.5.6.

*(8) Die plating and mounting requirements in accordance with 30.5.7.

*(9) Glassivation requirements in accordance with 30.5.8.

*(10) Die thickness requirements in accordance with 30.5.9.

*(11) Laser scribing for die separation in accordance with 30.5.10.

*(12) Internal lead separation in accordance with 30.5.11.

*(13) Workmanship and rework provisions (including rebonding) in accordance with 30.7.

*(14) Responsibility for tests and inspection in accordance with 40.1.

*(15) Procedures for microcircuits held by manufacturers and distributors in accordance with 40.2.

*(16) General inspection conditions in accordance with 40.3, except that all references to GSI and associated QAR include CSI and associated QAR of the acquiring activity.

*(17) Quality conformance inspection in accordance with 40.5, except that the manufacturer's electrical test specifications in accordance with 1.2.1a above may replace military detail specifications. End point electrical parameters specified in 1.2.1a, with specified minimum or maximum limits or both, shall be tested as required in MIL-STD-883, method 5005 or method 5010 as applicable. For devices having an initial release date after (29 May 1987) the subgroups to be tested, and the parameters that constitute a subgroup, shall, as a minimum be equivalent to those of the most similar detail military specification. Note: The group C inspection shall be implemented on all devices with an inspection lot date code of 8939 and later. Inspection lots formed using die fabricated prior to 1989 shall be grandfathered (does not require further group C testing) according to the previous group C QCI requirements.

*(18) Screening in accordance with 40.6, except that the manufacturer's electrical test specifications in accordance with 1.2.1a above may replace the military detail specifications. Final electrical parameters specified in 1.2.1a with specified minimum or maximum limits or both shall be 100 percent tested according to the subgroups required in MIL-STD-883, method 5004 or 5010 as applicable. For class S, dynamic burn-in (condition D or E) shall be used for both 100 percent screen test and steady-state life test. The allowable exception is when the military detail specification for the specific device type does not require dynamic but static burn-in. In the case where a military detail specification does not exist for a particular device type, the burn-in shall be as specified in the military detail specification for a similar device type and technology (see 40.5.4.1.1 of appendix A of MIL-I-38535).

*(19) Data recording in accordance with 40.7.

*(20) Packaging in accordance with 50.1.

*(21) Product assurance program in accordance with appendix C of MIL-I-38535, except that the manufacturer certification referenced in 30.1 shall be accomplished by an organization within the manufacturer's company that is independent of the production group responsible for device screening, or by an independent organization outside the company.

*(22) Statistical sampling table, test and inspection procedures in accordance with appendix D of MIL-I-38535.

Supersedes page 3 of MIL-STD-883D.

*(23) Package configurations in accordance with 30.5.1.2.

*(24) Microcircuit group assignments in accordance with 40.5.4.1.1.

*(25) Notification to the acquiring activity of change of product in accordance with 30.4.2.1.

*(26) Wafer lot acceptance in accordance with 30.4.5.

*(27) Traceability in accordance with 30.4.6.

*(28) C of C (certificate of conformance) and acquisition traceability in accordance with 30.3.1, except that conformance shall be to this paragraph of MIL-STD-883.

*(29) Ordering data in accordance with 60.1.

*(30) Electrostatic discharge sensitivity classification in accordance with 30.4.1.4. ESD testing classification results (or class one marking assigned without test) shall be submitted to DESC-EC for all MIL-STD-883 1.2.1 compliant SMD device types, and retained by the manufacturer (to be made available to the acquiring activity upon request) for device types compliant with 1.2.1 of MIL-STD-883 which are neither QML nor SMD devices.

*(31) Process monitor program in accordance with 30.4.1.2.2.

*c. Hybrid microcircuits described as compliant or multichip microcircuits described as compliant to MIL-H-38534, shall as a minimum, be produced in a facility certified to MIL-STD-1772 and meet all the requirements of MIL-H-38534 (or equivalent procedures/requirements of reciprocal listing provisions for product of other nations based on existing international agreements):

Microcircuits that comply with the requirements of 1.2.1 a and b above shall be marked with the following (specified paragraph numbers refer to appendix A of MIL-I-38535):

*a. Index point in accordance with 30.6.1.

*b. Part number, (for programmed or otherwise altered devices, the altered item identification shall be added to the altered devices by the altering activity and the marking required herein shall not be removed).

*c. Inspection lot identification code in accordance with 30.6.3.2 except the unique suffix letter may be omitted when an alternate lot identifier is used which maintains the unique traceability required in 30.6.3.2.

*d. Manufacturer's identification in accordance with 30.6.4.

*e. Country of origin, or a unique code which identifies the country of origin in accordance with 30.6.6 and a cross reference is published in the manufacturer's data books or catalog.

*f. Electrostatic discharge sensitivity identifier in accordance with 30.6.9.2.

*g. Marking location and sequence in accordance with 30.6.9.

*h. Container marking in accordance with 30.6.10.

*i. Marking option for controlled storage in accordance with 30.6.11.

*j. Marking option for quality conformance inspection in accordance with 30.6.12.

*k. Compliance indicator "C". The compliance indicator "C" shall be replaced with a "Q" certification mark when building to a QML flow in accordance with 1.2.

Supersedes page 4 of MIL-STD-883D.

Any device that is processed with deviations and which is not processed in compliance with the provisions of 1.2.1 defined herein shall not be claimed to be compliant and shall not be marked "/883", "/883B", "/883S", or any variant thereof. All applicable documentation (including detail specifications or manufacturer's data sheets and responses to RFQ's invoking MIL-STD-883) shall clearly and specifically define any and all areas of nonconformance and identify them as deviations in language that is not subject to misinterpretation by the acquiring authority.

If the contract or order specifically requires compliance with, equivalence to, or a product that is equal to or better than MIL-STD-883 class B or class S, any exceptions taken to the requirements of the referenced quality level (i.e., 1.2.1 above) shall prohibit the manufacturer from claiming or implying equivalence to that level.

*Specific reference to one or more MIL-STD-883 method(s) on a stand-alone basis requires compliance to only the specifically referenced method(s). Such devices are not considered compliant in accordance with 1.2.1 above. However, compliance with only the test procedures contained in test methods 5004, 5005, and 5010 on a stand-alone basis does not satisfy the form, fit, and function requirements of MIL-STD-973 for configuration items, and any reference to these methods requires compliance to all the provisions of 1.2.1.

When a QML device or a JAN device or a SMD device exists, the order of precedence for parts selection shall be as specified in requirement 64 of MIL-STD-454.

Supersedes page 5 of MIL-STD-883D.

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