scope:

This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes:

a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproducibility of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions.

b. To describe in one standard all of the lost methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices.

c. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard.

When this document is referenced or used in conjunction with the processing and testing of JAN devices in conformance with the requirements of appendix A of MIL-PRF-38535, QML devices in conformance with MIL-PRF-38535 or non-JAN devices in accordance with 1.2.1 or 1.2.2 herein, such processing and testing shall be in full conformance with all the applicable general requirements and those of the specifically referenced test methods and procedures.

For contracts negotiated prior to 31 December 1984, device types that have been classified as manufacturer's 883 (B or S) product prior to 31 December 1984 shall not have to meet 1.21 or 1.2.2.

Existing contracts as of the 31 December 1984, previously negotiated add-ons to these contracts, and future spares for these contracts may continue to use device types which were classified as manufacturer's 883 (B or S) prior to 31 December 1984.

New contracts, and any device types classified as compliant to MIL-STD-883 after 31 December 1984 shall comply with 1.2.1. Any devices meeting only the provisions of 1.2.2 are noncompliant to MIL-STD-883.

When any manufacturer, contractor, subcontractor, or original equipment manufacturer requires or claims a non-JAN part compliant with MIL-STD-883, all provisions of Appendix A of MIL-PRF-38535 shall be met. In addition, manufacturers that have produced or are producing products in accordance with 1.2.1a are subject to a Government compliance validation audit on a drop-in basis with a minimum of notice. Such processing and testing shall be in compliance with all of the applicable general controls and requirements defined herein and those of the specifically referenced test methods and procedures with no reinterpretations, deviations or omissions except as specifically allowed in the device specification or standard microcircuit drawing covering the same generic device. Deviations specifically granted in the device specification or standard microcircuit drawing may also be applied to devices manufactured in the same process, to the same design criteria, and using elements of the same microcircuit group as those used for devices covered by the device specification or standard microciruit drawing. Such reference include the following:

Manufacturers who use MIL-STD-883 in device marking, or make statements in applicable certificates of conformance that parts are compliant with MIL-STD-883, or make statements in advertisements or in published brochures or other marketing documents that parts provided are compliant with MIL-STD-883.

* Contractors, sub-contractors, or original equipment manufacturers who prepare vendor item drawings, (previously called Specification Control drawings), or Selected Item drawings which require compliance with MIL-STD-883, or invoke it in its entirely as the applicable standard (see 1.2.2 for noncompliant devices).

a. Custom monolithic, non-JAN multichip and all other non-JAN microcircuits except non-JAN hybrids described or implied to be compliant with methods 5004 an d 5005 or 5010 of MIL-STD-883 shall meet all of the non-JAN requirements of Appendix A of MIL-PRF-38535.

b. Hybrid microcicuits described as compliant or multichip microcircuits described as compliant to MIL-PRF-38534 shall meet all the requirements of MIL-PRF-38534 (or equivalent procedures/requirements of reciprocal listing provisions for product of other nations based on existing international agreements):

Any device that is processed with deviations and which is not processed in compliance with the provisions of 1.2.1 defined herein shall not be claimed to be compliant and shall not be marked "/883", "/883B", "/883S", or any variant thereof. All applicable documentation (including device specifications or manufacturer's data sheets and responses to RFQ's invoking MIL-STD-883) shall clearly and specifically define any and all areas of nonconformance and identify them as deviations in language that is not subject to misinterpretation by the acquiring authority.

If the contract or order specifically requires compliance with, equivalence to, or a product that is equal to or better than MIL-STD-883 class B or class S, any exceptions taken to the requirements of the referenced quality level (i.e., 1.2.1 above) shall prohibit the manufacturer from claiming or implying equivalence to the level.

Specific reference to one or more MIL-STD-883 method(s) on a stand-alone basis requires compliance to only the specifically referenced method(s). Such devices are not considered compliant in accordance with 1.2.1 above. However, compliance with only the test procedures contained in test methods 5004, 5005, and 5010 on a stand-alone basis (without specifying compliance or noncompliance to 1.2.1) does not satisfy the form, fit, and function requirements of MIL-STD-973 for configuration items, and any reference to these methods on a stand alone basis requires compliance to all the provisions of 1.2.1.