CEI EN 61190-1-2
Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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| Organization: | CEI |
| Publication Date: | 1 April 2015 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Electronic component assemblies): | 31.190 |
scope:
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.
Document History
CEI EN 61190-1-2
April 1, 2015
Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This...
February 1, 2008
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
La presente Norma fa parte della serie IEC 61190 e definisce le caratteristiche delle paste saldanti, specificando proprietà, metodi di prova e criteri di ispezione.
I materiali trattati sono le...
May 1, 2003
Materiali di fissaggio per assiemi elettronici - Parte 1-2: Prescrizioni per paste saldanti flussate per interconnessioni di alta qualità nell'assemblaggio dei componenti elettronici
La presente Norma internazionale fa parte della serie IEC 61190 e definisce le caratteristiche delle paste saldanti, specificando proprietà, metodi di prova e criteri di ispezione.
I materiali...