Ipc-A-610 Solder Standards

This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies....

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods...

This standard is a collection of visual quality acceptability criteria for solder paste printing. Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing...

This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used...

This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used...

This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used...

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and...

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-silver, tin-copper-silver, and...

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-silver, tin-copper-silver, and...

1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-silver, tin-copper-silver, and...

This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony- copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver,...

This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more...

This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more...

This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test redundancy. This specification shall establish the requirements for: • The evaluation of...

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force,...

This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...

This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the minimum of test redundancy. This specification shall establish the requirements for: The...

1. SCOPE The material defined by this specification is a paste solder consisting of prealloyed powdered solder metal and an organic-type flux.

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and...

Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended...