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JIS B 8461 - PCB (printed circuit board) assembly robots - Interfaces
February 20, 2002 - JSA
A description is not available for this item.
JIS B 8462 - PCB (printed circuit board) assembly robots - Safety
December 20, 2000 - JSA
A description is not available for this item.
JIS B 0144 - PCB (printed circuit board) assembly robots - Vocabulary
December 20, 2000 - JSA
A description is not available for this item.
MIL-P-60504 - PRINTED CIRCUIT BOARD ASSEMBLY Q-SWITCH TIMING
NPFC
A description is not available for this item.
IPC-7912 - End-Item DPMO for Printed Circuit Board Assemblies
January 1, 2004 - IPC

This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices: • Defects Per Million Opportunities...

JIS B 8460 - PCB (printed circuit board) assembly robots - Presentation of characteristics and functions
February 20, 2002 - JSA
A description is not available for this item.
DIN EN 16602-70-28 - Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014
June 1, 2015 - DIN

The requirements and procedures for repair and modification detailed in this Standard are designed to maintain the rigorous standards set by the customer for the manufacture and assembly of space-quality printed circuit boards. This Standard is confined to the repair and...

IPC-HDBK-850 - Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
July 1, 2012 - IPC

For the purpose of this document potting can be thought of as the ''liquid material'' and encapsulation can be interpreted as the application process and cure. Please keep in mind however that the terms potting and encapsulation are commonly interchanged with each other in a variety of electronic...

IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions
April 1, 2015 - IEC

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

DS/EN 60194 - Printed board design, manufacture and assembly – Terms and definitions
July 31, 2006 - DS

This Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

IPC/JEDEC-9704 - Printed Circuit Assembly Strain Gage Test Guideline
February 1, 2012 - IPC

This document is meant to be used as a methodology for strain gage placement and subsequent testing of Printed Circuit Assemblies (PCAs) using strain gages. The method describes specific guidelines for strain gage testing of PCAs during the printed board...

IPC-2517 - Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description [ASEMT]
November 1, 2000 - IPC

This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly...

IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION
June 1, 2008 - IPC

IPC C-103 is a hardcopy compilation of IPC documents of guidelines for adhesives used in assembly of printed circuit boards. Documents were reviewed and recommended for inclusion by IPC's technical staff. These IPC documents can be viewed individually through the appropriate...

IPC-SMEMA 3.1 - SMEMA FIDUCIAL MARK STANDARD
January 1, 2019 - IPC

This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards. SMEMA standards have also been developed for Mechanical/Electrical Equipment Interfaces (1.1) and for Software/Communications Interfaces (2.0)....

IPC-2516 - Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description [BDASM]
November 1, 2000 - IPC

This standard specifies data formats used to describe printed circuit board assembly product manufacturing methodologies. These formats may be used for transmitting information between a printed circuit board designers, board fabricators, and...

MIL-C-47273 - CLEANER, PRINTED CIRCUIT ASSEMBLY
NPFC
A description is not available for this item.
IPC-M-104 - Standards for Printed Board Assembly Manual
February 1, 2004 - IPC

This document provides information for preparation of components for assembly to printed boards, contains a review of some pertinent design criteria, impacts and issues, techniques of general interest for assembly (both manual and machines) and discusses considerations of, and...

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