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The Soldering Technology Committee (STC) of the Electronic Components, Assemblies & Materials Association, the electronic component sector of Electronic Industries Alliance prepared this specification.
This specification covers tin-coated annealed copper wire intended for electrical and electronic applications where solderability is a requirement. The tin shall be electroplated for the coating and shall be commercially pure. The base metal shall be copper of such quality and...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture...
This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and failure...
1. SCOPE The material defined by this specification is a paste solder consisting of prealloyed powdered solder metal and an organic-type flux.
Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended application. It...
This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in...
This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131
This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.
This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.
This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.
This specification covers electrical connections made with single, solid, round copper or copper alloy wire wrapped around copper alloy terminals without the use of solder.
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
