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This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design...
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related...
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of...
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of...
The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of...
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized...
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized...
The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally...
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical...
The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to...
