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This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple...
This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple...
This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple...
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general...
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the...
This specification covers a premixed lead free tinning solder compound. This material consists of finely powdered lead free tinning solder suspended in a liquid flux used for the purpose of simultaneously cleaning and tinning welded body joints prior to...
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating...
This PAS defines for circuit card assemblies (CCA) - a default method for those companies that require a pre-defined approach and - a protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the PAS) is intended for use by electronic equipment...
This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free technology. The terms lead-based and lead-free refer to alloys used in soldered assemblies. This report provides guidance for:...
This Standard specifies the methods for measuring of melting temperature ranges of lead-free solders (hereafter referred to as "solder alloys") that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as...
This PAS defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that Aerospace and High Performance (AHP) electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for...
This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large...
This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a...
This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality,...
