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CEN - EN ISO 9453

Soft solder alloys - Chemical compositions and forms

active, Most Current
Organization: CEN
Publication Date: 1 October 2020
Status: active
Page Count: 24
ICS Code (Brazing and soldering): 25.160.50
scope:

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Document History

EN ISO 9453
October 1, 2020
Soft solder alloys - Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING - National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
October 1, 2006
Soft solder alloys - Chemical compositions and forms
A description is not available for this item.

References

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