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BSI - BS IEC 62047-41

Semiconductor devices – Microelectromechanical devices Part 41: RF MEMS circulators and isolators

active, Most Current
Organization: BSI
Publication Date: 30 June 2021
Status: active
Page Count: 36
ICS Code (Other semiconductor devices): 31.080.99

Document History

BS IEC 62047-41
June 30, 2021
Semiconductor devices – Microelectromechanical devices Part 41: RF MEMS circulators and isolators
A description is not available for this item.

References

This document references:
IEC 60050-726 - AMENDMENT 1 International electrotechnical vocabulary Part 726: Transmission lines and waveguides
Published by IEC on December 1, 2016
A description is not available for this item.
This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document references:
IEC 60747-16-4 - Semiconductor devices – Part 16-4: Microwave integrated circuits – Switches
Published by IEC on August 1, 2017
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. There are many...
This document references:
IEC 60749-10 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1
Published by IEC on August 1, 2003
A description is not available for this item.
This document references:
IEC 60749-12 - Semiconductor devices – Mechanical and climatic test methods – Part 12: Vibration, variable frequency
Published by IEC on December 1, 2017
This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It...
This document references:
IEC 60749-21 - Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability
Published by IEC on April 1, 2011
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
This document references:
IEC TS 61967-3 - Integrated circuits – Measurement of electromagnetic emissions – Part 3: Measurement of radiated emissions – Surface scan method
Published by IEC on August 1, 2014
This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit...
This document references:
IEC 60749-22 - Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
Published by IEC on September 1, 2002
A description is not available for this item.
This document references:
IEC 62047-1 - Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
Published by IEC on January 1, 2016
This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices
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