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SAE USCAR-40 - Lead-Free Solder Validation Test Plan
April 1, 2011 - SAE

This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple...

SAE USCAR40-1 - Lead-Free Solder Validation Test Plan
April 1, 2015 - SAE

This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple...

Lead-Free Solder Interconnect Reliability
January 1, 2005 - ASM
A description is not available for this item.
Lead-free Solders: Materials Reliability for Electronics
January 1, 2012 - WILEY

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the...

9981999 - Premixed Lead Free Tinning Solder
December 1, 2002 - GMNA

This specification covers a premixed lead free tinning solder compound. This material consists of finely powdered lead free tinning solder suspended in a liquid flux used for the purpose of simultaneously cleaning and tinning welded body joints prior to...

ASTM STP1530 - LEAD-FREE SOLDERS
ASTM
A description is not available for this item.
IEC/PAS 62647-3 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead-free solder and finishes
July 1, 2011 - IEC

This PAS defines for circuit card assemblies (CCA) - a default method for those companies that require a pre-defined approach and - a protocol for those companies that wish to develop their own test methods. The default method (Section 4 of the PAS) is intended for use by electronic equipment...

ARINC 671 - GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
March 15, 2006 - ARINC

This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free technology. The terms lead-based and lead-free refer to alloys used in soldered assemblies. This report provides guidance for:...

JIS Z 3198-1 - Test Methods for Lead-Free Solders - Part 1: Methods for Measuring of Melting Temperature Ranges
June 20, 2014 - JSA

This Standard specifies the methods for measuring of melting temperature ranges of lead-free solders (hereafter referred to as "solder alloys") that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as...

IEC/PAS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Lead-free management
June 1, 2011 - IEC

This PAS defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that Aerospace and High Performance (AHP) electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for...

GEIA-HB-0005-2 - Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes
November 1, 2007 - SAE

This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality,...

IEC TR 60068-3-12 - Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
October 1, 2014 - IEC

This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large...

IEC/TR 60068-3-12 - Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile
March 1, 2007 - IEC

This part of IEC 60068 serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a...

IEC 62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 3: Selection guidance of erosion test methods
January 1, 2017 - IEC

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components...

CEI EN 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal materials without surface processing
April 1, 2014 - CEI

This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten...

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