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Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended...
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.
The dielectric strength test (also called highpotential [Hi-Pot], over potential, or voltage breakdown) consists of the application of a test voltage for a specific time between mutually insulated portions of a printed board or between insulated portions and ground. This is used to prove that the...
This document is intended to cover all aspects, both method and degree, of cleaning associated with the preparation of bare printed circuit boards prior to solder mask application. It continues with the prudent control of the cleanliness level during the solder mask...
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the minimum of test redundancy. This specification shall establish the requirements for: The...
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test redundancy. This specification shall establish the requirements for: • The evaluation...
Requirements for a dry film solder mask with good resistance to heat and solvents, suitable for application to appropriate base materials for printed circuits specified in BS 4584.
This test method is used to characterize the cleanliness of printed wiring board fabrication processes by determining the degradation of electrical insulation resistance under conditions of high temperature and humidity. This test method examines the cleanliness of a test substrate prior to...
5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux,...
5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux,...
The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes,...
This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux,...
