UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

BSI - BS EN 61191-1

Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies

inactive
Buy Now
Organization: BSI
Publication Date: 15 January 1999
Status: inactive
Page Count: 38
ICS Code (Printed circuits and boards): 31.180
scope:

Specifies materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also includes recommendations for good manufacturing processes.

Document History

BS EN IEC 61191-1
November 30, 2018
Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
A description is not available for this item.
BS EN 61191-1
September 30, 2013
Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
A description is not available for this item.
BS EN 61191-1
January 15, 1999
Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
Specifies materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also includes...

References

This document references:
IEC 61190-1-1 - Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Published by IEC on October 1, 2007
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
This document references:
IEC 61191-4 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Published by IEC on July 1, 2017
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the...
This document references:
IEC 61193-1 - Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies
Published by IEC on December 1, 2001
A description is not available for this item.
This document is referenced by:
BS EN 61191-6 - Printed board assemblies Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Published by BSI on May 31, 2010
A description is not available for this item.
This document is referenced by:
BS EN 61188-5-5 - Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
Published by BSI on December 31, 2007
A description is not available for this item.
This document is referenced by:
BS EN 61188-5-8 - Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Published by BSI on May 30, 2008
A description is not available for this item.
This document is referenced by:
BS EN 61191-3 - Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
Published by BSI on September 30, 2017
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement