This Addendum provides modified and additional requirements over those published in IPC/WHMA-A-620D to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space...
IPC-C-1000 is a hardcopy compilation of IPC documents that includes all of the C-10X segment collections, plus selected additional documents. Documents were reviewed and recommended for inclusion by IPC's technical staff. These IPC documents can be viewed individually through...
This document prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. This document describes material tests that generate portable data for: (1) direct comparison of...
IPC C-103 is a hardcopy compilation of IPC documents of guidelines for adhesives used in assembly of printed circuit boards. Documents were reviewed and recommended for inclusion by IPC's technical staff. These IPC documents can be viewed individually through the appropriate...
Statement of Scope This specification sets the requirements for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. This specification is intended to set requirements for IAg deposit thickness based on performance criteria. It is intended for use by supplier, printed...
This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate...
This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It...
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper...
ABSTRACT There is a growing need for a method of evaluating the solderability retention capability of printed circuit parts during inventory storage. These circuit parts, including components, connectors, sockets and printed wiring boards are usually joined together by soldering, hence...
This Standard specifies requirements for magnesium alloy forgings (hereafter referred to as forgings). NOTE The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows. ISO 3116 : 2007 Magnesium and magnesium alloys - Wrought...
Scope and application This programme is applicable for the approval of material manufacturers of: Aluminium alloy castings as referred in the Society's rules and standards. For a description of general requirements, conditions and procedures related to the approval, please refer to DNVGL CP...
This standard prescribes general requirements for highquality soldering of electronic interconnections. (Processes are restricted to those soldering alloys having liquidus temperatures below 427°C [800°F].) Purpose. This standard defmes the approved materials, methods, and inspection...
This Standard specifies the magnesium alloy extruded profiles (hereafter referred to as profiles ) with a solid or hollow cross section, which are manufactured by extrusion. NOTE The International Standard corresponding to this Standard and the symbol of degree of correspondence are as...
This specification covers aluminum-alloy extruded tubes round and other than round of the alloys designated in Table I. NOTE 1.-For drawn tubes, reference should be made to the Specification for Aluminium-Alloy Drawn Seamless Tubes (ASTM Designation: B210).3 3Appears in this...
This document is meant to be used as a methodology for strain gage placement and subsequent testing of Printed Circuit Assemblies (PCAs) using strain gages. The method describes specific guidelines for strain gage testing of PCAs during the printed board manufacturing process, including assembly,...
Covering the latest research in alloy physics together with the underlying basic principles, this comprehensive book provides a sound understanding of the structural changes in metals and alloys -- ranging from plastic deformation, deformation dynamics and ordering kinetics right up...
This specification covers three nickel-copper alloys for static or centrifugal casting for corrosion resistant service. Nickel-copper alloy castings shall be of the following compositions, as specified (see 6.2): Composition M-30C (see 6.1.1) M-30H (see 6.1.2) M-25S (see 6.1.3)
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